会议城市:杭州（会议时间：2020年4月18-19日是否eiistp收录:eiistp双收录截稿日期:2020年4月17日ei会议ei检索每月出版1期，文摘1.3万至1.4万条；每期附有主题索引与作者索引；每年还另外出版年卷本和年度索引，年度索引还增加了作者单位索引。
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2020第3届机械工程工业材料与工业电子国际会议(meimie 2020)2020 3rd international conference on mechanical engineering, industrial materials and industrial electronics (meimie 2020)一、ei会议地点、时间2020年4月18-19日，杭州二、征稿主题，包括但不限于以下：○机械工程：mechanical engineering○控制技术：control technology○机电工程：mechatronics engineering○工业自动化：industrial automation○工业材料：industrial materials○电子信息：electronic information○工业电子：industrial electronics
三、ei会议出版
iop conference series《materials science and engineering》issn: 1757-8981出版（期刊在ei列表中
四、ei检索会议投稿须知论文要求：论文应是未经发表的原创论文，须全英文撰写，详细请按照大会提供的模板撰写学术论文。审稿周期：投稿1-2周内，先投稿先送审先发录用，分批提交。
welcome to meimie 2020!
meimie2020 is the one of the most comprehensive conference focused on the various aspects of these most advanced topics. through the joint efforts and support of everyone, this year, it is the second time ofmeimieto be hosted. the goal ofmeimie2020 is to bring the researchers from academia and industry as well as participants together to share the newest researches and ideas, also problems and solutions relating to the multifaceted aspects ofmechanical engineering, control technology, mechatronics engineering, industrial automation, industrial materials, electronic information and industrial electronics, promoting the development of these disciplines effectively. the updating of complete list of topics is finished. please click the call for papers section to know more related information.we are glad to see you in ourconference!
paper publication
all submissions must be original, unpublished, and not submitted concurrently for publication elsewhere, and will be reviewed by two or three experts from the pc. all accepted papers of 2020 3rd international conference on mechanical engineering, industrial materials and industrial electronics (meimie 2020)will be publishedby the open access iop conference series"materials science and engineering" issn: 1757-8981, which will be indexed byei compendex, istp (cpci),(thomson reuters, web of science),scopus, inspec and other databases.
the open access iop conference series provides a fast, versatile and cost-effective proceedings publication service for your conference. key publishing subject areas include: physics, materials science, environmental science, bioscience, engineering, computational science and mathematics.
important dates
important dates of 2020 3rd international conference on mechanical engineering, industrial materials and industrial electronics (meimie 2020):
full paper submission(round 1)
march 18, 2020
full paper submission(round 2)
april 18, 2020
notification of acceptance
5-10 days after submission
authors registration & payment
please refer to acceptance letter
conference date
april18-19, 2020
academic official visit
april 20, 2020