High-Density Plastic Encapsulated Integrated Circuit Lead Frame Tining Equipment Series

Product Description

Product Description
High-density plastic encapsulated integrated circuit lead frame tining equipment series
Speed: 3-12m/min
Specifications: 1-2 channels
Cladding: CPK≥1.67
The way of unlaod and offload: Strip to Strip By the steel belt toclamp
Applicable product width: 20-110mm; thickness: 1-12mm
Our equipment can achieve the integrated automatic production of electrolytic softening, high-pressure water jet, high-speed tin plating and blanking, through the feeding system,plastic-packaged ic lead frame is continuously clamped and fixed on the continuously running transmission steel belt.

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FAQ
FAQ
Q:Are you manufacturer or trading company ?
A:We are a professional manufacturer of large-scale research and production of semiconductor wet process equipment. We have a professional research and development team and production and assembly workshop, which can ensure quality and after-sales service.
Q:What is the width of the equipment ?
A:The width of the equipment is about two meters.
Q:How long is the warranty ?
A:The warranty period of our equipment is one year. One-step service, professional engineers to follow up to solve the problem.
Q:What is the packaging of the equipment like? What is the delivery method?
A:Standard export fumigation sign wooden box packing or delivery by land or sea.
Q:how to install and debug the equipment after its arrival ?
A:After the equipment is issued, we will arrange a senior installation and debugging team to the your company to complete the installation,debugging,training,etc.,and assist your company in the early mass production.