BERGQUIST GF1500 GAP FILLER TGF 1500 thermal paste

Product Details

Product Description

Product Description
BERGQUIST GF1500 Features and Benefits
• Thermal conductivity: 1.8 W/mK
• Optimized shear thinning
characteristics for ease of dispensing
• Excellent slump resistance
(stays in place)
• Ultra-conforming with excellent wetout
for low stress interface applications
• 100% solids – no cure by-products
• Excellent low- and high-temperature
mechanical and chemical stability
Thermal paste of BERGQUIST GAP FILLER TGF 1500 is a two-part, high performance, thermally
conductive, liquid gap-filling material, which features exceptional slump resistance and
high shear thinning characteristics for optimized consistency and control during dispensing.
The mixed system will cure at room temperature and can be accelerated with the
addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness
variations with little or no stress to the sensitive components during assembly. BERGQUIST
GF1500 exhibits low level natural tack characteristics and is intended for use in applications
where a strong structural bond is not required. As cured,BERGQUIST Gap Filler 1500 (Two-Part)
provides a soft, thermally conductive,form-in-place elastomer that is ideal for fragile assemblies
and filling unique and intricate air voids and gaps.
Thermal paste of BERGQUIST GF1500 Typical Applications Include:
• Automotive electronics
• Computers and peripherals
• Between any heat generating semiconductor and a heat sink
• Telecommunications
Configurations Available:
• Supplied in cartridge or kit form
• With or without glass beads