China Silicon Wafer Small Single-Side Grinding and Polishing Machine

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
High precision grinding machine equipment principle:
1. The grinding machine is a precision grinding and polishing equipment. The grinding and polishing materials are placed on the grinding disc, the grinding disc rotates against the clock, the correction wheel drives the workpiece to rotate, the gravity pressure is applied to the workpiece, and the workpiece and the grinding disc are subjected to relative running friction to achieve the purpose of grinding and polishing.
2. The disc repairing machine uses the hydraulic suspended guide rail to move back and forth, and the diamond shaving knife trims the grinding disc precisely, so that the grinding disc gets precise flatness.

SPECIFICATION

Standard Specification
Machine Model	FD3803		FD4603		FD6103		FD9104
Plate Diameter	Φ380 mm / 15 inches		Φ460mm / 18 inches		Φ610mm / 24 inches		Φ910mm / 36 inches
Max. Workpiece Diameter (without conditioning ring)	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Conditioning Ring Diameter	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Number of Station	3		3		3		4
Plate Rotate Speed	0-140 rpm		0-140 rpm		0-120 rpm		0-90 rpm
Facing & Grooving Speed (Not include in Polishing)	0-120 mm/m		0-120 mm/m		0-120 mm/m		0-120 mm/m
Total Weight	450 kg		780 kg		1000 kg		1600 kg
Total Floor Space	670×940 mm		1030×730 mm		1920×840 mm		2100×1300 mm
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

Main uses:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, molds, light guide plates, light spinner joint valves, hydraulic tight, stainless steel, and other materials single-sided grinding, polishing.
grinding disc flatness can reach ±0.002mm; The flatness of the workpiece with a diameter of 50mm can reach 1/4 wavelength. The flatness of the workpiece after processing can reach ±0.0005mm.
the use of imported bearings, motors, to ensure the stability and life of the equipment, to ensure the precision requirements of the workpiece.

High precision grinding machine features:
1, frequency conversion control, soft start, soft stop, small impact, reduce workpiece damage.
2, using the timing function to control the time, processing products can be set in advance on the panel time and speed, working time jump to the set time, the machine automatically stops working, can better control the size of the product.
3, grinding machine workpiece pressure using weight weight pressure, polishing workpiece surface brightness, no scratch, no scratch, no grain, no pitting, no edge, high flatness characteristics. After polishing the workpiece surface roughness can reach Ra0.002;
4, the use of interval automatic spray device, can freely set the spray interval time, the grinding liquid can be evenly sprayed on the grinding disc, to achieve the stability of the workpiece. Reduce the grinding time, save the cost of consumables, but also meet the requirements of the environment.
SAMPLE DEMONSTRATION (SINGLE PLATE)
About the Company Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people Patent

Delivery & Packing
Packing Details : Packing, 1 pcs/Wooden box.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.