Precise Control of Dimensional Precision Thinning Equipment

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
High precision transverse grinding machine equipment features:
1. The thickness of 150 wafer can be reduced to 0.08mm thick without breaking. And the parallelism and flatness can be controlled within the range of ±0.002mm.
2. High thinning efficiency, LED sapphire substrate grinding speed can be reduced by up to 48 microns per minute. Silicon wafers can be thinned up to 250 microns per minute.
3. Series grinding machine adopts CNC program control system, touch screen operation panel.
Principle of high precision transverse grinding machine equipment:
1. This series of transverse thinning grinding machine is full-automatic precision grinding equipment, which is rotated in the opposite direction by the vacuum sucker or electromagnetic sucker and the grinding wheel. The grinding wheel swings back and forth. The grinding resistance is small, the workpiece will not be damaged, and the grinding efficiency is high.
2. The equipment can automatically check the grinding torque, and automatically adjust the workpiece grinding speed, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the grinding wheel wear thickness.
APPLICATION

Process	Industry by Substance	Industry by Applicability
Single Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Phone Frame(flat)	back plate
		PCB	adhesive, coating, circuit
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Radar	oxide coating plate
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION

Standard Specification
Model number	YM-150WH	YM-180WH	YM-200WH	YM-230WH	YM-300WH
Diamond grinding wheel dimensions	Diameter 150*H25	Diameter 180*H25	The diameter is 200*H30	The diameter is 230*H30	The diameter is 300*H30
Maximum size of workpiece	Diameter 150mm	Diameter 180mm	Diameter 200mm	Diameter 230mm	Diameter 300mm
Workpiece speed (adjustable)	0---1000rpm	0---1000rpm	0---800rpm	0---800rpm	0---800rpm
Grinding wheel speed (adjustable)	0---2000rpm	0---2000rpm	0---1800rpm	0---1800rpm	0---1800rpm
Motor power of grinding wheel	1.5kw.380 V,3 phase.	1.5kw.380 V,3 phase.	2.2kw.380v,3 phases	2.2kw.380v,3 phases	2.2kw.380v,3 phases
Sucker spindle motor power	0.75kw.380v.3 phase	0.75kw.380v.3 phase	0.75kw.380v.3 phase	0.75kw.380v.3 phase	1.1kw.380v,3 phases
Control accuracy (parallelism)	1um(diameter 100mm)	1um(diameter 100mm)	1um(diameter 100mm)	1um(diameter 100mm)	1um(diameter 100mm)
Overall dimension	1200*550*1550	1200*550*1550	1350*600*1600	1350*600*1600	1500*700*1650

Built-In Optional Kits
Grade		Standard			Advanced
Slurry Recycle System		-			Integrated with PLC
Dressing System		-			Integrated with PLC
Station Fixing		Mechanical Fixture			Pneumatic Vacuum Fixing
Spindle		Mechanical			Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)
Patent
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
Production and assembly shop We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.