ID Cutting Machine for Semiconductor Material

Product Description

Product Description

INNER CIRCLE SLICER
Details
Inner circle fully automatic slicing machine is using inside circle to cut a variety of semiconductors, crystal, ceramic, NdFeB magnetic material.
Installed in the spindle, the edge-type Diamond blade cutter is high-speed rotating, the table was feeding by computer control of horizontal and vertical movement, the material on the fixture of the table was cut into the required product.
We have the semi-automatic/fully automatic inner circle clicking machine, within a circle slicer two kinds of specifications, a variety of models.
For the Automatic Slicer inner circle. a worker can operate about 16 units slicer at the same time.
MD-IDC9580
Main technical parameters:
Max machining size(mm):φ95 ×80 mm
Cutting speed (cm²/mm):3-6(cm²/mm)
Degree of balance sheets by cutting deviation(mm):±0.005mm
Cutting film thickness(mm):≥0.30
The thin-cut tolerance(mm):±0.005mm
Horizontal stroke(mm):120mm
Longitudinal travel(mm):110mm
Spindle Electrical:3 Phase 0.75kw
Spindle Speed (r/min):2800Rev / min
Adjust the amount of work clamp:
Horizontal angle:±45º
Pitch angle of elevation:±10º
Vertically(mm):20
Cooling tank capacity(kg):50kg
Cooling tank motor: 3 Phase 0.12kw 2780r/min
Power:Three-phase four-wire 50Hz 380V
Dimensions(mm):1130 ×850 ×1500
Weight(kg):~1400(kg)
Contact:
Guangzhou Minder-hightech Co.,ltd
No.1 Xingya 3rd road, Panyu district, Guangzhou, Ghina
contact: Shunyu Hu

www.minder-hightech.con