US$48,000.00-200,000.00
|
1 set
(MOQ)
|
Basic Info.
Certification
CE, ISO 9001: 2015
Suitable for
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Maximum Worksize
1000X1000X1000mm
Maximum Running Speed
1200m/Min
Test Cut
Provide Test Cut Service
Dimension
3470X3500X3200mm
Transport Package
Wooden Case
Production Capacity
350sets/Year
Product Description
Product Description
DCX800 Single-wire Saw
DCX800 Single-wire Saw uses single diamond wire to cut super hard and brittle materials such as large size Sapphire, Quartz Crystal, Optical Glass, Jade, etc. With swing cutting function, through the diamond wire swing thus reduce the product cutting area and achieve the cutting of super hard and brittle materials.
Product Features
>Stable Frame
The machine body is whole-casted, which makes high speed running stable and reliable.
>Flexible Cutting
Horizontal displacement worktable makes cutting flexible and efficient.
>High Efficiency
Set swing cutting function for diamond wire for high efficiency.
>Cut Large Size Materials
Suitable for cutting large size workpiece, the maximum cutting size is up to 800x800x800mm.
>Wire break memory system.
Cut Samples
Product Parameters
Detail | Parameter |
Model | DCX1000 |
Maximum work size | 1000mm*1000mm*1000mm |
Number of workbench | 1 |
Storage | 40Km |
Running Speed | Max1200m/min |
Wire diamond | φ0.25mm~φ0.6mm |
Cutting method | Diamond wire feeds parallel or swinging downwards |
Workbench swing angle | ±30° |
Cutting fluid | Water-based cutting fluid or cutting oil |
Fluid storage | 355L |
Fluid flow rate | 180L/min |
Power | Three-phase 380V 50Hz |
Full-load Power | 25kw |
Size L*W*H | 3470mm*3500mm*3200mm |
Weight | 12000Kg |
About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.