Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Equipment structure
The equipment is mainly composed of frame, air spindle, porous ceramic suction cup (suitable for various types of ring), vacuum spindle deceleration motor, static pressure air suspension electric spindle, diamond grinding wheel, screw guide module, full closed-loop servo control system, cutting fluid circulation system, etc.
Products Show
Equipment features
1. The vacuum spindle is made of 603 stainless steel material, which is not easily affected by thermal expansion and leads to the precision of grinding size, and the bearing is made of well-known brands.
2. Vacuum suction cups are divided into microporous ceramic suction cups and special stainless steel gas slots, which can be selected according to product requirements.
3. The vacuum spindle is driven by precision reducer and servo motor.
4. The rotor of the static pressure gas suspension spindle adopts zirconia ceramic, which completely avoids the heat transmitted by the motor causing the gas film gap to be too large after the expansion of the floating rotor and reduces the rigidity of the spindle. The equipment using the spindle has high precision and good stability.
5. Screw guide module adopts high precision and high preloading type.
6. Full closed-loop grating control system: to ensure the servo motor to the precision of the grinding wheel feed monitoring and repair.
7. Grinding fluid circulation system: The grinding fluid in the production process continues to cool the workpiece, grinding wheel and electric spindle through the circulation system, and the grinding fluid can also improve the self-sharpness of the grinding wheel.
APPLICATION

Single Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Phone Frame(flat)	back plate
		PCB	adhesive, coating, circuit
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Radar	oxide coating plate
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION

Technical parameter
The size of the vacuum sucker is	300mm
Maximum processing size	300mm
Work plate speed (continuously adjustable)	0-300rpm/min
Wheel size	300mm(12 inches)
Grinding wheel spindle power	7.5kw
Product processing thickness error	≤±0.003mm(medium 100mm)
Product processing flatness	≤0.003mm(medium 100mm)
Feed repeated positioning accuracy	0.001mm
Roughness	Ras0.2
Vacuum negative pressure	20-90Kpa
Grinding mode	Wafer rotation, axial in-Feed grinding
Mode of operation	Semi-automatic grinding method (manual loading and unloading)
Equipment dimensions	1200*1100*2100mm
Weight	2350KG

Built-In Optional Kits
Grade		Standard		Upgraded		Advanced
Controls		Digital		Digital		Touch-Screen PLC
Pressure Source		Hand Weight Block		Pneumatic Weight Block Manual		Pneumatic Press Integrated with PLC
Slurry Supply System		-		Manual		Digital, Manual
Cylinder Bar Drive System		-		Manual		Integrated with PLC
Conditioning Ring Drive System		-		Manual		Integrated with PLC
Machine Enclosure		-		Framed by Aluminum Alloy		Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)
About the Company
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
Production and assembly shop We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
Patent
Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.