US$1,000.00-7,000.00
|
1 Piece
(MOQ)
|
Basic Info.
Applicable Material
Metal
Laser Wavelength
Fiber Laser
Laser Classification
Semiconductor Laser
Product Name
UV Laser Marking
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Product Description
Product Description
Brief Description
1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm. 3. PCB marking and cutting.
Features:
1. With cold laser processing and small heat-affected zone, it can achieve high quality processing. 2. Wide applicable materials range can compensate for the shortage of infrared laser processing ability. 3. With good beam quality and small focusing spot, it can achieve superfine marking. 4. High marking speed, high efficiency, and high precision. 5. No consumables, low cost and low maintenance fee. 6. The overall machine has stable performance, supporting long-term operation.
Specifications:
Machine model | EP-15/25/30-THG-S |
Laser wavelength | 355nm |
Laser power | 4W / 7W / 10W /15W / 25W |
Min. marking line width | 10µm-15µm |
Marking speed | 250 characters/sec |
Marking scope | 100*100mm |
Standard lens | F160 |
Pulse repetition frequency | 10-200kHz |
Cooling mode | Water cooling |
Power supply | AC 220V, 50Hz, 16A |
Total power consumption | ≤1.5kW |
Overall dimension | 800mm*950mm*1630mm |
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.