Semiconductor Device Fab Crystal Semiconductor Square Bar Rounding Forming Grinding Machine Magnetic Equipment

Product Description

Product Description
The square grinding machine is a special equipment for grinding small square bars.Diamond grinding wheels and guide wheels mounted on the spindle rotate in the positive direction to grind the small square bar into small cylinders. The grinding amount is large and the efficiency is high. The biggest advantage of the square grinding (rounding) machine is that the small square bar is ground(rolled) into a cylinder at a time, and the minimum processing diameter can reach 0.8mm, which is especially suitable for fine materials. Our factory square grinding machine has semi-automatic and fully automatic two models. One worker operates one machine in semi-automatic square grinding. One worker operates a semi-automatic square grinding circle, and one worker can operate multiple fully automatic square grinding circles at the same time.
Application
Magnetic materials (NdFeB, SmCo, ferrite, niobium, etc.), optical glass, crystal, semiconductor, graphite, ceramic, silicon wafer, gemstone and other hard brittle materials
Technical Parameters

Maximum processing size (mm)	Φ3square blank, Φ6 cylindrical blank
Minimum processing size (mm)	Φ0.8
Grinding length range (mm)	10-50
Grinding speed (min)	Continuous feeding 600-800mm
Grinding accuracy (mm)	Rough grinding non-roundness ±0.04, Fine grinding non-roundness ±0.03
Guide wheel table lateral stroke (mm)	80
Up and down stroke of guide plate (mm)	25
Main motor(AC380V x 52HZ)	1.5kw ×1460r/min
Secondary motor electronic adjustment motor	1.1kw × (0-1200r/min)
Dimension(mm)	890 *800 *1200
Weight	400(kg)

We have many types of machines, such as ID slice machine(Inner circle slicer, inside diameter slicer, ID saw), Automatic square bar rounding grinding machine, semi-auto square grinding machine