High Precision Insert for Semiconductor Packaging Mold

High Precision Insert for Semiconductor Packaging Mold

US$150.00-3,000.00 1 Piece (MOQ)

Basic Info.

Model NO.
High precision insert for semiconductor packaging
Type
Plastic Mould Parts
Material
Customized
Application
Electronic, Machinery, Semiconductor Packaging Molds
Certification
ISO9001
ODM
Avialable
Transport Package
PE Sealed Bag, Carton Box, Pallet
Trademark
Guoyu
Origin
Dalian China
Production Capacity
600 PCS/Year

Product Description

Product parameters
Product Name High precision insert for semiconductor packaging mold
Material Customized
Hardness Customized
Heat treatment Available
Service Made-to-order
Surface treatment Chrome
Closest tolerance 0.002mm
Polishness Ra 0.1
Customised Available

International advanced process technology is used when processing and manufacturing Complete quality assurance system to ensure the mechanical properties of the products and service could achieve the first level Provid the excellent quality, fast delivery, effective cost and considerate service


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