US$3.90-5.60
|
10 kilograms
(MOQ)
|
Basic Info.
Classification
Other Adhesives
Main Agent Composition
Silicone
Characteristic
Waterproof
Promoter Composition
Filler
Composition
Organic Material
Other Names
Thermal Silicone Grease
Application Temperature
-50 to 200 Degree
Single Gross Weight
1.100kg
Single Package Size
5X5X10cm
Shipment
by Sea or by Air
Thermal Conductivity
1W/M.K
Main Raw Material
Silicone
Production Capacity
1000000 Tons/Year
Product Description
TG is a metal oxide filled silicone mixture with excellent thermal conductivity. The mixture of high-purity filler and silicone is white, smooth and uniform, with almost no oil separation or
high temperature volatilization and truly remarkable thermal conductivity.It is mainly used on the assembly surface of semiconductor devices and radiators to eliminate the air on the contact surface, increase the heat flow channel and improve the heat conduction. This means that electronic devices can operate at lower temperatures, thereby increasing their efficiency and lifetime.
Product Features
. Moisture-proof, strong reliability
. Strong weather resistance, high and low temperature resistance
. Low freeness (tends to 0)
. Excellent thermal conductivity, low thermal resistance
. Corrosion resistance, aging resistance and ozone resistance
. Wetting the contact surface can reduce the thermal resistance and achieve better heat conduction effect.
Typical applications Chip processors BGA, flash memory chips Power components, LEDs Special-shaped heating devices Thechnical Data
Test Item | Unit | TG-10 | TG-15 | TG-20 | TG-30 | TG-40 | TG-50 | Test Method |
Appearance | / | White | white | Light gray | Dark gray | Dark gray | Dark gray | Visual inspection |
Density | 25ºC,g/cm³ | 2.0±0.1 | 2.4±0.1 | 2.9±0.1 | 3.0±0.1 | 3.2±0.1 | 3.2±0.1 | ASTM D792 |
Thermal conductivity | W/m.k | 1.0±0.1 | 1.5±0.1 | 2.0±0.2 | 3.0±0.3 | 4.0±0.4 | 5.0±0.5 | ISO/DIS22007-2.2 |
Thermal resistance | in2k/w, 0.1mm@270KPa | 0.18 | 0.15 | 0.12 | 0.09 | 0.06 | 0.03 | ASTM 5470 |
Taper penetration | 25ºC | 300±25 | 320±25 | 340±25 | 250±25 | 240±25 | 240±20 | GB/T269-1991 |
Volatile | 200ºC,24h,% | ≤1.0 | ≤1.0 | ≤1.0 | ≤1.0 | ≤1.0 | ≤1.0 | HG/T2502-93 |
Operating temperature | -50~+150 | -50~+150 | -50~+150 | -50~+150 | -50~+150 | -50~+150 | -50~+150 | GB/T2423.2 |
Thermal resistance | in2k/w(@320KPa) | 0.06 | 0.07 | 0.05 | 0.04 | 0.04 | Dark gray | ASTM 5470 |
Product Application Thermal Interface Material can be used in 36 electronics industry, here are some application examples.
LED lighting, LED TV Backlight module, switching power supply Medical equipment, communication equipment Mobile device, 5G network products Video equipment, home appliances PC server/workstation, base station
Plant Overview ShenZhen DoBon Technology Co., LTD produce thermal conductive and heat dissipation materials. We are a thermal solution provider integrating production, design, R&D and sales. We own 10,000 square meter production base, more than 100 employees, and serves 3,000 customers We have 20 sets of production equipment and 4 sets of fully automated production lines
FAQ Q: Are you trading company or manufacturer ?
A: We are manufacturer, our factory in Dongguan city, China. Welcome to visit us.
Q: How long is your delivery time?
A: Each 100,000 pieces, we need about 3 days to produce.
Q: Do you provide samples ? is it free or extra ?
A: Sample is available, please you need to pay for it.
Q: How to customize a sample?
A: Please send us design of your products, such as size, shape, etc. We can customize your products.