CX2121 Multi-Wire Cutting Equipment with Diamond Wire Saw

CX2121 Multi-Wire Cutting Equipment with Diamond Wire Saw

US$48,000.00-200,000.00 1 set (MOQ)

Basic Info.

Model NO.
CX2121
Condition
New
Certification
CE, ISO 9001: 2015
Automation
Automatic
Suitable for
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Maximum Worksize
204X210X210mm
Maximum Running Speed
1200m/Min
Test Cut
Provide Test Cut Service
Dimension
2200X1900X2400mm
Weight
3000kg
Transport Package
Wooden Case
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description
CX2121 Multi-wire Saw
CX2121 Multi-wire Saw is designed with double-workbench to meet the demand for batch processing of super-hard materials such as Sapphire, Quartz Crystal, Optical Glass, Special Ceramics, Metal Composite/Alloys into straight sheets.Five wire guide rollers design is mainly used to cut straight sheets of 5mm-60mm thickness.
Product Features
>Double Workstation
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Flexible Roller System
Achieve the cutting of products within 5-60mm thickness with the flexible wire winding for 3 rollers and five rollers.
>Easy Operation
Roller cutting system, workbench, tension system, take-up and pay-off and wire winding system are set in a plane for easy operation.
>Optimized Pulley Design
6 pulleys design can reduce wire breakage rate and achieve convenient wire winding.
>Flexible Cutting
The left and right slide table on the workbench can be independently moved back and forth, and the left and right sides can cut products of different thicknesses.
>Convenient Insttallation and Removal
The rollers are fastened with screws and equipped with special electric wrench for convenient disassembling and installation.
>Swing Cutting Function
Adding swing function to workbench to achieve the opening square cutting of semiconductor silicon carbide.
>Wire break memory system.
Cut Samples

Product Parameters
DetailParameter
ModelCX2121
Maximum work size204x210x210mm
Slice thickness5-60mm(wire winding number:≤40)
Workbench quantity2
Roller out diameter *Workable width(φ160-185mm)x210x5
Wire diameterφ0.20-φ0.37
Wire spool storage
20km(φ0.25mm)
Maximum running speed1200m/min
Travel of worktable lifting240mm
Travel of worktable translation100mm
Worktable swing angel
0
Cutting methodVertically upward movement
Cutting feed speed
0.1~99.9mm/min
Cutting fluid
Water-based cutting fluid or cutting oil
Fluid storage800L
Fluid flow rate
200L/min
Power supply380V±10% 50HZ
Power22Kw
Size L*W*H2200x1900x2400mm
Weight3000kg
About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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