Ultra-Precision Double-Side Grinding and Polishing Equipment for Sapphire, Silicon Wafer, Optical Crystal and Other Materials

Ultra-Precision Double-Side Grinding and Polishing Equipment for Sapphire, Silicon Wafer, Optical Crystal and Other Materials

US$30,000.00-50,000.00 1 Piece (MOQ)

Basic Info.

Model NO.
6BL
Type
Surface Grinding Machine
Processing Object
Flat Workpieces
Abrasives
Grinding Wheel
Controlling Mode
Pcl
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Material
Metal
Variable Speed
with Variable Speed
Application
Grinding Industry
Service
Oversea Setup & After-Sale Avalaible
Class
Double Plate
Process Station
3-5
Pressure Source
Pneumatic
Plate Material
Metal and Non-Metal
Abrasive
Lapping Slurry
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Main features of double-sided machine
1, the use of AC inverter motor drive, soft start, soft stop, stable and reliable.
2, grinding machine adopts four stages of pressure, that is, light pressure, medium pressure, heavy pressure, repair operation process
3, the column grinding machine adopts torsion operation, frequency conversion speed regulation, the motor speed and running time can be directly input on the control panel.
4, oil pressure lifting gear ring [Microsoft user 1], very stable.
5, the upper plate is separately set with a slow drop cylinder, not only effectively prevent the fragile workpiece from breaking, but also independent pressure control.
6, through the use of electronic preset counter, the number of grinding cycles, requirements can be accurately controlled.
7. Diamond dressing wheel can be used to repair the disc.
8. The large size design of the drive shaft enhances the rigidity of the shaft, thereby eliminating the jitter caused by insufficient rigidity.
This machine is mainly used for grinding or polishing silicon wafer, quartz wafer, optical crystal, glass, sapphire on both sides
SPECIFICATION
Standard Specification
Machine Model FD6B FD9B FD13-6B
Lower Plate Diameter Φ386 mm / 15 inches Φ640 mm / 25 inches Φ973 mm / 38 inches
Upper Plate Diameter Φ386 mm / 15 inches Φ640 mm / 25 inches Φ973 mm / 38 inches
Star Wheel Parameter DP 12, Z=66, A=20° DP 12, Z=108, A=20° DP 19.3, Z=152, A=20°
Conditioning Ring Parameter DP 12, Z=66, A=20° DP 12, Z=108, A=20° DP 19.3, Z=152, A=20°
Max. Workpiece Diameter Φ120 mm Φ180 mm Φ290 mm
Process Thickness 0.2mm≤N≤20mm 0.2mm≤N≤25mm 0.2mm≤N≤30mm
Number of Station 3≤N≤5 3≤N≤5 3≤N≤5
Plate Rotate Speed 0-60 rpm 0-60 rpm 0-50 rpm
Total Weight 600 kg 2000 kg 3200 kg
Total Floor Space 700×950 mm 1350x960 mm 1700×1380 mm
Built-In Optional Kits
Grade Standard Advanced
Slurry Supply System - Integrated with PLC
Facing and Grooving System - Integrated with PLC
Machine Enclosure - Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (DOUBLE PLATE)
Patent
About the Company Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

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