Pangda Touch Screen High Automation High Speed Grinding and Thinning Machine Manufacturer

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Vertical thinning machine main features:
1, sucker according to customer process requirements can be divided into electromagnetic sucker and vacuum sucker, sucker size can be customized according to customer needs, diameter 320-600mm.
2. The grinding wheel spindle adopts precision high-speed rotating motorized spindle, and the driving mode is frequency conversion speed regulation. The speed can be adjusted according to different process requirements and the driving mode supported by PLC control system.
3. The grinding wheel feed mode is set in three sections, which can more conveniently set the effective thinning scheme and improve the precision and surface effect after thinning.
4, the tool in the case of not changing the grinding wheel and sucker, for different thickness of the workpiece only need one tool can work continuously, do not need to set the tool every time.
5, the machine adopts high precision screw and guide rail components, the driving mode is servo drive, according to different materials of the workpiece and process requirements by PLC control of the driving mode and the corresponding change of screw speed, that is, the grinding wheel feed speed, speed 0.001-5mm/min adjustable, control feed precision by high resolution grating ruler detection.
6, this machine adopts advanced Taiwan brand PLC and touch screen, high degree of automation, man-machine dialogue, simple operation at a glance.
7. The equipment can detect the grinding torque and automatically adjust the grinding speed of the workpiece, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the thickness of the grinding wheel wear, so that the thickness of the 150 wafer can be reduced to 0.08mm without breaking. And the parallelism and flatness can be controlled within the range of ±0.002mm.
8. High thinning efficiency, LED sapphire substrate grinding speed can be reduced by up to 48 microns per minute. Silicon wafers can be thinned up to 250 microns per minute.
APPLICATION

Process	Industry by Substance	Industry by Applicability
High Speed Grinding & Thinning	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	sealing ring(liquid, oil, gas)
		Semiconductor	substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
		Plastic	Hard Plastic
		Optics(flat)	optical lens, optical reflector, holographic glass, HUD glass, screen glass
		Gemstone	jade, sapphire, agate, etc.
		Others	gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.

SPECIFICATION

Standard Specification
Machine Model	FD170T		FD220T	FD320T		FD450T
Station Diameter	Φ150 mm / 6 inches		Φ220 mm / 8 inches	Φ320 mm / 12 inches		Φ460 mm / 18 inches
Max. Workpiece Dimension	Φ150×30 mm		Φ220×50 mm	Φ320×50 mm		Φ460×50 mm
Process Thickness	50μm≤N		75μm≤N	95μm≤N		120μm≤N
Grating Resolution	0.5 μm		0.5 μm	0.5 μm		0.5 μm
Number of Station	1		1	1		1
Wheel Rotate Speed	0-3000 rpm		0-3000 rpm	0-3000 rpm		0-3000 rpm
Station Rotate Speed	0-300 rpm		0-300 rpm	0-300 rpm		0-300 rpm
Total Weight	650 kg		850 kg	900 kg		920 kg
Total Floor Space	1200×550 mm		1150×1200 mm	1150×1200 mm		1150×1200 mm
Built-In Optional Kits
Grade		Standard			Advanced
Slurry Recycle System		-			Integrated with PLC
Dressing System		-			Integrated with PLC
Station Fixing		Mechanical Fixture			Pneumatic Vacuum Fixing
Spindle		Mechanical			Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (THINNING)
Patent
About the Company Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.