CA400 Diamond Multi-Wire Saw Cutting Machine for Sapphire Quartz Crystal Processing Tool

Product Description

Product Description
CA400 Multi-wire Saw
CA400 Multi-wire Saw is designed to meet customers' demands for batch processing of Sapphire, Quartz Crystal, Special Ceramics, Silicon Nitride and other super hard and brittle materials into straight sheets. The machine can reduce the cutting area through workpiece swing to improve cutting speed. Show economy and practicality while ensuring processing efficiency, operational stability and process applicability.
Product Features
>Easy Installation
The rollers adopt double-cone positioned structure for convenient installation and disassembly.
>Optimized Pulley Design
8 pulleys design can reduce wire breakage rate and achieve convenient wire winding.
>Swing Cutting
Stronger cutting force with swing cutting.
>Underside Workbench
Underside workbench for convenient operation.
>Easy Operation
The cutting room is open on 3 sides for easier operation and maintenance.
>Wire Break Memory System
Cut Samples

Product Parameters

Detail	Parameter
Model	CA400
Maximum work size	φ125x260mm
Workbench qty	1
Roller out diameter *Workable width	(φ145±10mm)*266mm*3
Wire diameter	φ0.12mm-φ0.25mm
Wire Spool Storage	20km(φ0.25mm)
Maximum running speed	900m/min
Travel of workbench lifting	30mm
Workbench swing	±7°
Cutting method	Vertically upward movement
Cutting feed speed	0.1-99.9mm/min
Cutting fluid	Water--based cutting fluid or cutting Oil
Fluid storage	220L
Fluid flow rate	200L/min
Power Supply	Three-phase 380V 50Hz
Rated power	30kw
Air supply	Adopting water-based cutting fluid, the air pressure is ≥ 0.35MPa.
SizeL*W*H	3100mm*1490mm*2360mm
Weight	4000Kg

About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.